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| KYOCERA America, Inc. (U.S.A.), Kagoshima Kokubu Plant (Japan) |
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| Developed from ceramic and organic materials, Kyocera’s cutting-edge semiconductor package products range from substrates with high-density wiring patterns to multilayer packages with embedded components. |
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Kyocera's semiconductor packages and substrates feature high-density circuitry, making them indispensable in mobile phones, digital consumer electronics, computers, fiber optic communications, wireless infrastructure, and automotive electronics. |
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Surface Mount Packages for Electronic Devices |
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Image Sensor Components |
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LTCC Packages for RF Modules |
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Components for Fiber Optic Communications |
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Multilayer Organic Packages for LSI*
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| *Large Scale Integration |
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| Related link |
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